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JPR Compares Dell Model to @Xi Mobile Workstation JPR Compares Dell Model to @Xi Mobile Workstation
By Robert Dow, Jon Peddie Research JPR compares @Xi Systems' @Xi PowerGo 15/7 mobile workstation to the Dell Precision 5510. What do they think? Find out here!
Check Out NX 12 in Action! Check Out NX 12 in Action!
By Siemens PLM Software Get a sneak preview of the cool functionality coming in NX 12 like Multiple Displayed Parts, along with existing topology optimization features.
V-ZUG Maintains Swiss-made Quality with CATIA and ENOVIA V-ZUG Maintains Swiss-made Quality with CATIA and ENOVIA
By Dassault Systemes Swiss appliance manufacturer V-ZUG chose Dassault Systemes' 3DEXPERIENCE to manage product development in one single environment.
Got 20 Minutes? See ANSYS AIM in Action Got 20 Minutes? See ANSYS AIM in Action
By ANSYS If you're a design engineer hesitant to learn engineering simulation software then this short session is for you. See how easty it is in ANSYS 18.1.
ANSYS AIM Streamlines Shell and Tube Heat Exchanger Design ANSYS AIM Streamlines Shell and Tube Heat Exchanger Design
By ANSYS ANSYS AIM provides all of the physical models and simulation tools needed to diagnose and optimize a heat exchanger within a single user interface.
Zero-post Processing with Rize's APD Technology Zero-post Processing with Rize's APD Technology
By Rize This paper will define Rize's one-of-a-kind Augmented Polymer Deposition (APD), how it works and describe the advantages of the technology.
Rize One 3D Printer Speeds Part Turnaround 20% Rize One 3D Printer Speeds Part Turnaround 20%
By Rize A global consumer packaged goods manufacturer compared the part turnaround speed and costs of their Stratasys Fortus and Rize One 3D printers.
3D Printing: The Impact of Post-Processing 3D Printing: The Impact of Post-Processing
By Rize Industry expert, Todd Grimm, interviewed six global manufacturers to learn the impact of post-processing on time, cost, quality, and more.
Are You Using DfX Practices? Are You Using DfX Practices?
By ConnectPress and HCL Technologies This spring ConnectPress and Geometric (now part of HCL Technologies) surveyed readers to see how they were deploying Design for X (DfX) practices.
The Factory of the Future is Your Office and Beyond The Factory of the Future is Your Office and Beyond
By Rize Rize's Julie Reece discusses market potential for 3D printers to enable new direct manufacturing applications beyond the additive manufacturing lab.
ANSYS AIM Simplifies Simulation of LED Fixtures ANSYS AIM Simplifies Simulation of LED Fixtures
By ANSYS Thermal management of LED fixtures can be complicated by the multiple physics involved. See how ANYS AIM can simplify this process.
Democratizing Computational Fluid Dynamics Democratizing Computational Fluid Dynamics
By Mentor Graphics This paper looks at why CFD technology has a low uptake to being utilized by designers and has been reserved for engineers and how to overcome that.
7 Tips to Increase Productivity by Frontloading CFD 7 Tips to Increase Productivity by Frontloading CFD
By Mentor Graphics Read this paper by Mentor to see how to achieve the full benefits of frontloading CFD, including a successful implementation and early assessments.
ANSYS 18 Innovations - Signal Integrity, Power & EMI ANSYS 18 Innovations - Signal Integrity, Power & EMI
By ANSYS In this webinar learn about enhancements for the Chip-Package-System workflow to address design challenges in power and signal integrity, and ESD.
ANSYS AIM Streamlines Fatigue Analysis in a Single Interface ANSYS AIM Streamlines Fatigue Analysis in a Single Interface
By ANSYS ANSYS AIM is an excellent tool for gas cylinder design because it integrates structural analysis, fatigue life prediction and parametric design tools.
Webinar On Electronics Cooling Simulation in ANSYS 18 Webinar On Electronics Cooling Simulation in ANSYS 18
By ANSYS This webinar covers importing chip thermal models (CTM) from ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete IC, package and PCB.
Integrating PLM is Not a One-size-fits-all Approach
By Razorleaf Razorleaf provides 3 approaches to PLM integration, including an introduction to CLOVER, Razorleaf's integration platform, in this on-demand webinar.
Democratizing Analysis with ANSYS Icepak Democratizing Analysis with ANSYS Icepak
By ANSYS Traditionally the design engineer would have to pass the design to the mechanical/thermal engineer. ANSYS Iwave solves this issue.
Electronic PCB and Package Thermal Stress Analysis Electronic PCB and Package Thermal Stress Analysis
By ANSYS This paper explains the challenges and opportunities in preparing ECAD geometries for use with solvers associated with MCAD geometries.
Chip-Package-System Analysis Techniques for Thermal Design Chip-Package-System Analysis Techniques for Thermal Design
By ANSYS ANSYS' latest release (R17) adds significant improvements in the area of predicting thermal responses for system design early in the design cycle.
Accurately Predict Performance of Printed Circuit Boards Accurately Predict Performance of Printed Circuit Boards
By ANSYS This paper presents a reference design flow for solving electrical, thermal and mechanical challenges of PCB's using simulation tools from ANSYS.

Learn How Better PLM Integration Leads to Better Business
By Razorleaf and Tech-Clarity In this webinar series Razorleaf and Tech-Clarity share best practices for PLM integration and survey findings. Listen on-demand and join April 25th.
What's New in NX 11.0.1 for Design Engineering What's New in NX 11.0.1 for Design Engineering
By Tom Spangler, Siemens PLM Software Learn about new draft capabilities, Topology Optimization and the new Combine command for trimming surfaces.
Did Your Request Make the List for SW 2018 Top Ten? Did Your Request Make the List for SW 2018 Top Ten?
By Rita Stange, ConnectPress Managing Editor Top user requests for SOLIDWORKS 2018 revealed at SOLIDWORKS World included a Sub-D modeling tool and allow zero thickness geometry.